Description:

[High tin running speed] High tin running speed, low smoke emission, and high insulation resistance on the surface after curing. [High tin running speed] High tin running speed, low smoke emission, and high insulation resistance on the surface after curing. [Function] The surface tension of the substance will affect the quality of soldering, another function of the solder paste is to reduce the tension of the material. [Advantage] The high temperature of soldering is easy to oxidize the surface of the soldering material, and the solder paste helps prevent the oxidation process. [Application] Used in mobile phone PCB, BGA and PGA SMD rework solder paste and low ion system. [Easy to Carry] Small size, easy to carry and store, convenient to use and with good performance.