Description:

300 high temperature resistant in the short run, 250 high temperature resistant for a long time.. High extensibility that higher than 35% and high peel strength up to 5N/25mm enable this heat resistant adhesive tape to work for a very long time.. High insulation ensures the safety.. Adopting special adhesive with strong adhesive force to achieve no dirt left after peeling.. 33m*0.55mm size makes the heat insulation adhesive tape suitable for BGA chip welding..